The Plasma Enhanced Chemical Vapor Deposition system (PECVD, tool #3) is a Plasmatherm 790 engineered for research, development, and pilot production using Plasma Enhanced Chemical Vapor Deposition. This process is performed in a reactor at temperatures up to 400 deg. C. The deposited film is a product of chemical reactions of the source gases supplied to the reactor. A plasma is generated in the reactor to increase the energy available for the chemical reaction to take place.