The Batch Plasma Etcher (tool #1) is a Matrix System One model 303 Programmable microprocessor controlled system. The system is temperature controlled and is capable of handling wafer sizes from 2 - 6''. with Cassette loading capability. By using oxygen, plasma and heat the system can remove organic and inorganic contamination, strip photoresist, increase wettability, increase bonding strength, and remove residue.